SMTA International Conference Proceedings


Authors: Mike Bixenman, D. B. A. and Michael Konrad
Company: Kyzen Corporation and Aqueous Technologies Corporation
Date Published: 10/4/2009   Conference: SMTA International

Abstract: The need for cleanliness under individual components increases as the spacing between connector leads decreases and power increases. The low standoff height of QFNs traps flux between the ground pad and component leads. Entrapped flux under the QFN is a reliability concern. The purpose of this paper is to make an argument for removing flux residue under the QFN post rework and present cleaning process options for meeting this cleaning challenge.

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