iNEMI SOLDER PASTE DEPOSITION PROJECT – FIRST STAGE REVIEW OPTIMIZING SOLDER PASTE PRINTING FOR LARGE AND SMALL COMPONENTSAuthors: Shoukai Zhang, et al.
Date Published: 10/4/2009 Conference: SMTA International
In the first stage of the project the printing to each pad was measured with automated 3D SPI systems and optimum combinations of parameters identified by statistical analysis. In this paper the authors will explain the methodology chosen to achieve the project objectives and indicate the direction of likely future work. Early results indicate that a key objective of the project, to provide evidence to support the case for a reduction in the keep out distances below the current industry standard, might be achievable.
Key words: Miniature and fine pitch components, keep-out distance, transfer efficiency, consistency
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