SUSTAINING A ROBUST FINE FEATURE PRINTING PROCESSAuthors: George Babka, David Sbiroli, Chris Anglin and Richard Brooks
Company: Assembléon America, Inc., Indium Corporation and Christopher Associates
Date Published: 10/4/2009 Conference: SMTA International
Most of the factors and critical parameters in ultra-fine pitch printing have been well understood and documented for over twenty years. Some of these parameters are squeegee speed, squeegee pressure, stencil design (technology, thickness & area ratio), and solder paste. But as the pitch and aperture sizes get smaller and smaller, we begin to see that additional factors start to have an increased effect on the solder paste deposition (transfer efficiency). What are these factors and can we control them in order to obtain acceptable results for transfer efficiency and minimized variability? This paper will evaluate these additional factors and how they affect the transfer efficiency of the paste.
Key words: ultra-fine pitch printing, separation speed, stencil technology, stencil design, pad design, solder powder, tooling, solder paste, area ratio.
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