BEST PRACTICES REFLOW PROFILING FOR LEAD-FREE SMT ASSEMBLYAuthors: Ed Briggs and Ron Lasky, Ph.D., PE
Company: Indium Corporation and Dartmouth College
Date Published: 10/4/2009 Conference: SMTA International
This paper is a summary of best practices in optimizing the reflow process to meet these challenges of higher reflow temperatures, smaller print deposits, decreased powder particle size, and their affect on the reflow process. It also discusses trouble-shooting of the most common defects in lead-free reflow, such as tombstoning, solder beading/balling, residue discoloration, voiding, graping, and head in pillow.
Key words: solder defects, reflow profile, tombstone, solder beads, solder balls, voids, head-in-pillow, graping.
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