Surface Mount International Conference Proceedings


A MICRO FLIP CHIP PROCESS FOR HIGH SPEED OPTOELECTRONIC COMPONENTS

Author: Tun S. Tan
Company: Hewlett-Packard Co.
Date Published: 9/10/1996   Conference: Surface Mount International


Abstract: Abroad-bandwidth optical receiver is one of the key components in multi-gigabit light wave test systems for long-haul fiber optic telecommunication links and gigabit optical inter-connect for computer systems. In order to achieve broadband and high speed operation, such optical receivers require minimization of parasitic capacitance and inductance. To meet these stringent requirements, we have developed and incorporated a micro-fiip-chip technology with our high speed InPPIN photodetectors. The micro-flipchip process which features lift-off based smaller diameter solder bumps, enables the fabrication of flip-chip photodetectors with minimum parasitic capacitance and inductance and enhanced responsivity. This technology has enabled the realization of a family of 7 GHz bandwidth optical receivers and a 9-channel optical receiver with gigabit per channel data rate for optical inter-connect application.



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