THE COMINGAuthor: Charles S. Leech Jr.
Company: Innovative Drying Co. LLC
Date Published: 10/4/2009 Conference: SMTA International
IPC/JEDEC J-Std-033 had previously set an economically unreasonable goal of driving all of the ingested moisture from moisture-sensitive surface mount packages that have exceeded their specified “floor-life.” The current three baking schedules make drying of surface mount packages that are either in tapes and reels or in plastic shipping tubes a lengthy or expensive operation.
"Floor-life" is the specified number of hours that a moisture sensitive package can be exposed to the factory atmosphere before it has absorbed sufficient moisture to make it susceptible to internal delamination at solder reflow temperatures.
The goal of the 24-hour, 70°C dry-baking process is to only partially dry packages thereby retrieving 50% or more of the device’s floor-life. The low baking temperature has been proven to be safe for low-cost commercial tapes, reels and shipping tubes.
This alternative process has been used in production by a number of leading electronic product assemblers for at least eighteen years. It is estimated that at least 180 million packages have been dried by this process without a reported moisture-induced device delamination.
This paper explores data from several in-house process studies. Findings from a more recent and extensive series of independent studies are presented. The critical portion of the paper points-out both the benefits and cautions that must be considered when adopting this fourth package drying-baking method.
Key words: moisture sensitive packages, package drying, dry-baking, J-Std-033
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