SMTA International Conference Proceedings


ASSESSMENT OF WHISKER GROWTH FROM TIN COATED WIRE AND CABLE

Author: Thomas Lesniewski
Company: Northrop Grumman Corporation
Date Published: 10/4/2009   Conference: SMTA International


Abstract: Pure tin is a common finish for copper hook up wire, coaxial cable, ground braid and harness assemblies used on electronics assemblies. Historically there have been few reports of tin whisker growth on tin coated copper wire, even on unjacketed wire. This paper presents data on past incidences of whisker growth on wire as well as analysis of wire samples of various size and age. Based on a limited sample size, the data indicate very low risk for whisker growth on tin coated copper wire, braid and cable.

Key words: tin coating, tin whisker, wire, braid, cable, intermetallic compound.



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