SMTA International Conference Proceedings


Author: Reza Ghaffarian
Company: California Institute of Tech
Date Published: 9/12/1999   Conference: SMTA International

Abstract: The JPL-led CSP Consortium of enterprises representing government agencies and private companies has joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. Last year (1), team members reported their experience on technology implementation challenges, including design and build of both standard and microvia boards, assembly of two types of test vehicles, and preliminary aging and thermal cycling test results on trial test vehicles. Since then, more than 150 test vehicles, single- and double-sided, have been assembled and are presently being subjected to various environmental tests. This paper presents the experience of three consortium team companies on characterizing reliability behavior under four different thermal cycling environments. Lessons learned on assembly are given in a paper included in this proceedings.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819