VIA RELIABILITY – A HOLISTIC PROCESS APPROACHAuthors: David L. Wolf, Timothy A. Estes, and Ronald J. Rhodes
Company: Conductor Analysis Technologies (CAT), Inc.
Date Published: 10/4/2009 Conference: SMTA International
The IPC PCQR2 Database provides a holistic approach to understanding the capability of the materials, equipment, and processes used in the manufacture of printed boards. In addition, the quality and reliability of printed boards fabricated under these conditions is established. This presentation will summarize recent findings of the impact of lead-free assembly on via reliability and provide a case study documenting the need for capable, controlled, and uniform printed board manufacturing processes.
Key words: Via interconnects, via reliability, lead-free, IPC PCQR2 Database, process capability.
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