SMTA International Conference Proceedings


Authors: Jonas Sjoberg and Andreas Morr
Company: Flextronics Mobile & Consumer
Date Published: 10/4/2009   Conference: SMTA International

Abstract: Miniaturization and the integration of a growing number of functions in portable electronic devices require a high packaging density for electronic components. One way to increase the packaging density is to reduce the size of the packages and at the same time increase the density of the I/Os. This means that the size and pitch of solder balls or pads in electronic component packages will continue to shrink.

The use of fine pitch components, equal and below 0,5mm pitch, poses a number of challenges for design, SMT assembly process and reliability.

First, a feasible assembly process must be achieved. The assembly process ranges all the way from screen-printing too in many cases underfill of CSP’s and LGA’s. Many factors influence the quality of the assembly process. The basic processes to control are screen-printing, pick & place, reflow soldering and underfill.

Second, the right materials (such as PCB material, PCB surface finish, solderpaste and underfill) and PCB design need to be selected to ensure a cost effective and reliable interconnect. Of coarse the mechanics of the products makes a big difference as well but it is very product dependant and many of today’s products leave little room for designing the mechanics in the most reliable way due to total cost and overall looks of the product.

This paper will discuss different assembly and material alternatives to make a handheld product as producer friendly, cost effective and reliable as possible.

Key words: Miniaturization, total cost and reliability

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