ASSESSING DESIGN TRADEOFFS WITH A CUSTOMIZABLE AREA-ARRAY CONNECTORAuthors: Paul Chen, Dinesh Kalakkad, Ken Matsubayashi, Woody Maynard, and John Williams
Company: Neoconix, Inc.
Date Published: 10/4/2009 Conference: SMTA International
A variety of design options are described for both BGA-mount and LGA-mount area-array connections. Through modeling and empirical testing, resulting output characteristics such as contact force, DC resistance, current capacity, inductance, capacitance, and bandwidth are presented. Key input/output relationships are then summarized.
Key words: connector design, land grid array, interposer, high density connector, design flexibility.
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