SMTA International Conference Proceedings


Authors: Paul Chen, Dinesh Kalakkad, Ken Matsubayashi, Woody Maynard, and John Williams
Company: Neoconix, Inc.
Date Published: 10/4/2009   Conference: SMTA International

Abstract: Performance targets for electrical connectors vary widely by application. Historically, re-configuring a standard connector to optimize electrical-mechanical performance for a specific application has not been feasible due to the cost, complexity, and lead-time of tooling modifications, coupled with limited degrees of freedom in design. This paper explores a photolithography-based approach to connector fabrication in which many design adjustments can be quickly and cost-effectively implemented in order to optimize performance in a given system.

A variety of design options are described for both BGA-mount and LGA-mount area-array connections. Through modeling and empirical testing, resulting output characteristics such as contact force, DC resistance, current capacity, inductance, capacitance, and bandwidth are presented. Key input/output relationships are then summarized.

Key words: connector design, land grid array, interposer, high density connector, design flexibility.

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