THE PROLIFERATION OF LEAD-FREE ALLOYSAuthors: Eric Bastow and Timothy Jensen
Company: Indium Corporation
Date Published: 10/4/2009 Conference: SMTA International
In addition to research relating to SAC305 and SAC105, much work has been performed on the study of the effects of small quantities (<0.1%) of alloying metals on lead-free alloys' process ability and reliability performance. These “dopants” can dramatically affect an alloy's performance.
All of the above work has resulted in what many are calling lead-free alloy proliferation as more and more alloys are being considered for implementation. This proliferation drives up solder paste cost as manufacturers cannot achieve economies of scale. In addition, with so many alloys to consider, it is difficult for researchers to develop extensive data bases of process and reliability performance.
This paper is an overview of this lead-free alloy proliferation and an outlook on how alloy convergence might occur.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.