SMTA International Conference Proceedings


Authors: Jean-Paul Clech, Gregory Henshall and Jian Miremadi
Company: EPSI Inc. and Hewlett-Packard Company
Date Published: 10/4/2009   Conference: SMTA International

Abstract: A closed-form Acceleration Factor (AF) model has been developed for solder joint reliability under thermal cycling conditions. The proposed AF formulation relies on a strain-energy failure criterion and an approximation of stress/strain hysteresis loop areas. The AFs are functions of temperature swings, temperature extremes, and hot and cold dwell times. The AF formulation accounts explicitly for creep of solder during hot and cold dwell periods. As a result of solder creep / stress relaxation during dwell times, the AF model includes the two material constants of a power-law creep rate equation, namely, a stress exponent and a creep activation energy. The component / assembly dependence of AFs, which can vary by a factor of 2.36 times or more according to experimental data and FEA modeling, is also accounted for via a single component correction factor. The paper presents the model formulation, its application to SAC305, SAC387/396/405 and SnPb assemblies, and discusses the type of data that is needed to extend the model to other lead-free solders or mixed assemblies. The advantages and limitations of this physically-based, closed-form model compared to other approaches in the reliability engineer’s toolbox are also discussed.

Key words: lead-free solder joint reliability, acceleration factors, accelerated thermal cycling, strain energy model, SAC305 solder.

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