JCAA/JG-PP LEAD-FREE SOLDER PROJECT: -20°C TO +80°C THERMAL CYCLE TESTAuthors: Thomas A. Woodrow, Ph.D.
Company: Boeing Research & Technology
Date Published: 10/4/2009 Conference: SMTA International
The solder alloys selected for test were:
Sn3.9Ag0.6Cu for reflow and wave soldering
Sn3.4Ag1.0Cu3.3Bi for reflow soldering
Sn0.7Cu0.05Ni for wave soldering
Sn37Pb for reflow and wave soldering
Test vehicles were assembled using these solders and a variety of component types and the test vehicles were thermally cycled from -20°C to +80°C. At the conclusion of the test, 27,135 thermal cycles had been accumulated.
The solder joints on the components were electrically monitored using event detectors and any solder joint failures were recorded on a Labview-based data collection system. The failures of a given component type attached with SnPb solder were compared to the failures of the same component type attached with lead-free solders by using Weibull analysis.
Key words: lead-free, thermal cycle, Weibull, CTE, JG-PP
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