SMTA International Conference Proceedings


JCAA/JG-PP LEAD-FREE SOLDER PROJECT: -20°C TO +80°C THERMAL CYCLE TEST

Authors: Thomas A. Woodrow, Ph.D.
Company: Boeing Research & Technology
Date Published: 10/4/2009   Conference: SMTA International


Abstract: Thermal cycle testing was conducted by Boeing Research & Technology (Seattle) for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) Lead-Free Solder Project. The JCAA/JG-PP Consortium is the first group to test the reliability of lead-free solder joints against the requirements of the aerospace/military community.

The solder alloys selected for test were:
Sn3.9Ag0.6Cu for reflow and wave soldering
Sn3.4Ag1.0Cu3.3Bi for reflow soldering
Sn0.7Cu0.05Ni for wave soldering
Sn37Pb for reflow and wave soldering

Test vehicles were assembled using these solders and a variety of component types and the test vehicles were thermally cycled from -20°C to +80°C. At the conclusion of the test, 27,135 thermal cycles had been accumulated.

The solder joints on the components were electrically monitored using event detectors and any solder joint failures were recorded on a Labview-based data collection system. The failures of a given component type attached with SnPb solder were compared to the failures of the same component type attached with lead-free solders by using Weibull analysis.

Key words: lead-free, thermal cycle, Weibull, CTE, JG-PP



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