LEAD-FREE ASSEMBLY AND QUALIFICATION OF A STORAGE CLASS PCBAAuthors: Matthew Kelly and Tom Truman, et al.
Company: IBM Corporation and Venture Corporation, Ltd.
Date Published: 10/4/2009 Conference: SMTA International
This paper will discuss the comprehensive qualification trial results of an IBM low/medium complexity tape storage device using a no-clean lead-free assembly process including primary attach SMT reflow, and hot gas BGA rework processes. Of particular interest in this study was the performance of in-circuit test (ICT) using next generation lead-free solders. Voiding performance, effects of multiple heat cycles, and overall ICT yield improvements were assessed.
Various tests were conducted to evaluate resultant time zero quality levels of the product vehicle including 5DX-ray, ICT, bulk solder joint formation via cross sectioning, and metallurgical analysis using SEM. Reliability performance of the product vehicle was tested using accelerated thermal cycling (ATC), high temperature storage (HTS), vibration and shock protocols. The materials / processes were assessed using Surface Insulation Resistance (SIR) electromigration testing on a specially designed test card.
Keywords: Lead-free storage class printed circuit board assembly (PCBA), product vehicle qualification trial, high reliability, low/medium complexity, next generation lead-free assembly materials, ICT yield improvements, cleaning no-clean flux chemistry.
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