Thus, one direction the project is taking is to perform experiments that will provide the industry with a clearer indication of the effect of alloy composition on the reliability performance of alloys in thermal cycling, including acceleration behavior. The other direction is the identification of a suite of test methods that companies can use to determine the suitability of a particular solder for their application.

This paper describes the experimental program devised for evaluating the performance of a range of alternative alloys in thermal cycling. Also discussed is the team's progress toward establishing standard test methods that could provide the industry with a basis for evaluating any lead-free solder from among the increasing number being offered.

Key words: Lead-free alloys, alternative alloys, low silver alloys, microalloying, reliability">

SMTA International Conference Proceedings


iNEMI LEAD-FREE ALLOY ALTERNATIVES PROJECT REPORT: THERMAL FATIGUE EXPERIMENTS AND ALLOY TEST REQUIREMENTS

Authors: Gregory Henshall, Ph.D., et al.
Company: iNEMI
Date Published: 10/4/2009   Conference: SMTA International


Abstract: The original motivation for initiating an iNEMI project on "alternative" lead-free solders was to help the electronics industry manage the introduction of new solder alloys by assessing the industry knowledge and identifying key gaps. Upon completion of this effort, the iNEMI team is now focused on addressing some of these gaps. Of particular concern is the performance of new solders in thermal cycling and having standard test data from which to evaluate alloy suitability for various product types.

Thus, one direction the project is taking is to perform experiments that will provide the industry with a clearer indication of the effect of alloy composition on the reliability performance of alloys in thermal cycling, including acceleration behavior. The other direction is the identification of a suite of test methods that companies can use to determine the suitability of a particular solder for their application.

This paper describes the experimental program devised for evaluating the performance of a range of alternative alloys in thermal cycling. Also discussed is the team's progress toward establishing standard test methods that could provide the industry with a basis for evaluating any lead-free solder from among the increasing number being offered.

Key words: Lead-free alloys, alternative alloys, low silver alloys, microalloying, reliability



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