SMTA International Conference Proceedings


IMPLEMENTATION AND RELIABILITY ISSUES WITH LEAD-FREE SOLDERS

Author: Christopher Hunt
Company: National Physical Laboratory
Date Published: 10/4/2009   Conference: SMTA International


Abstract: Manufacturing high reliability lead-free circuit assemblies is challenging, and understanding the pitfalls and knowing material properties is clearly desirable. This paper will address a wide range of issues, which include material and processing properties. Examples of these phenomena include: copper dissolution, tin whisker mitigation, PTH reliability, measuring solder joint reliability, conformal coating protection, and tin pest.



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