INNOVATIVE PACKAGE REALIZATION BY CHIP EMBEDDING TECHNOLOGIES
Authors: Lars Boettcher, Dionysios Manessis, Stefan Karaszkiewicz, Andreas Ostmann, and Herbert Reichl Company: Fraunhofer Institute for Reliability and Microintegration (IZM) and Technical University of Berlin Date Published: 10/4/2009
Abstract: The chip embedding technology achieved significant progress the last years. After various research activities the main focus is today on industrialization and implementation of new business models. In the project HERMES European partners from industry and research aim to bring embedding technology based on low-cost PCB /Printed Circuit Board) processes to a market-ready product flow, demonstrated by automotive, power electronics and telecommunication applications. The research part of the project aims to overcome current limitations and to achieve even higher levels of miniaturisation. This paper will describe the embedding process flow and will discuss the process steps in detail. An embedded QFN (Quad Flat No-Lead) package will be described and discussed. Especially the realisation of the QFN is a strong challenge for today's machine capabilities, since it contains a chip with a pitch of 100 µm.
Key words: 3D packaging, embedded chips, Chip in Polymer, System in Package, PCB technology