IMBEDDED COMPONENT/DIE TECHNOLOGY (IC/DT®): IS IT READY FOR MAIN STREAM DESIGN APPLICATIONS?
Authors: Casey H. Cooper, Mark T. McMeen, and Jim D. Raby Company: STI Electronics, Inc. Date Published: 10/4/2009
Abstract: Military and aerospace electronics providers continue to push the technological envelope to design and manufacture leading edge electronics for today's DOD users. Current design problems are not driven by circuit design capabilities but by an inability to reliably package these circuits within size and weight requirements (SWAP) outlined by the system level specifications. Innovative packaging techniques are required in order to meet the increasing size, weight, power, and reliability requirements of the DOD without sacrificing electrical, mechanical, or thermal performance. Emerging technologies such as those imbedding components within organic substrates have proven capable of meeting and exceeding these design objectives for meeting size, weight and power requirements. The ability to design smaller, lighter and less power circuit board assemblies that are more robust than conventional SMT boards has a future in the electronics of tomorrow. Imbedded Component/Die Technology (IC/DT®) addresses these design challenges through imbedding both active and passives into cavities within a multi-layer printed circuit board to decrease the surface area required to implement the circuit design and increase the robustness of the overall assembly. This paper discusses the design methodology, and validation / test data gathered during the implementation of IC/DT® in a mixed signal prototype. The prototype designed and assembled using IC/DT® processes was subjected to reliability testing and ultimately demonstrated in a test flight. The results from this testing as well as the future designs utilizing IC/DT are presented.
Key words: Size, Weight, Power, Reliability, Hi-Rel, 3D Assembly, Cavities, Thermal Core, Imbedded Components, IC/DT, and SWAP