Authors: David R. Tyler, Sarah E. Brady, Indre Thiel, and Robert L. Hubbard Company: University of Oregon and Lambda Technologies, Inc. Date Published: 10/4/2009
Abstract: It has been established that the use of microwave energy will produce cured epoxy-based films and adhesives with lower stress and enhanced thermo-mechanical properties [1,2]. Recent work has put forward the hypothesis that a different mechanism may result if the cure reaction takes place at temperatures at or below the gel point with microwave fields but not with standard convection heating. This study examines the chemical structures and morphologies of model polyamide and epoxy networks with FTIR and SEM. Correlations are made between the unique chemistry of microwave heating and the resulting mechanical properties including stress, elongation, modulus, brittleness, and crack propagation. The examination of a microwave cured commercial flip-chip under-fill material will be made to determine the usefulness of this new mechanism on the general epoxy class of electronic assembly adhesives and coatings.