Key words: Monte Carlo simulation, Surface mount, Head and pillow defect, Socket, Ball Grid Array (BGA), Dynamic warpage.">

SMTA International Conference Proceedings


MONTE CARLO SIMULATION FOR SURFACE MOUNT ASSEMBLY HEAD AND PILLOW DEFECT PREDICTION

Authors: Shijiang He, Gregorio Murtagian, Ph.D., and Fay Hua, Ph.D.
Company: Intel Corporation
Date Published: 10/4/2009   Conference: SMTA International


Abstract: Recent developments in central processing unit (CPU) package technology have led to significant increases in socket body size and reductions in solder ball pitch. These increase the risk in head and pillow (HnP) defects after surface mount reflow. This paper summarizes efforts in the occurrence probability study of HnP defects. It analyzes the "surface mount gap" between the solder balls and board taking into account socket specific design features, and illustrates a Monte Carlo (MC) simulation tool to predict HnP defect occurrence rate and locations. The limitation of the tool is also discussed.

Key words: Monte Carlo simulation, Surface mount, Head and pillow defect, Socket, Ball Grid Array (BGA), Dynamic warpage.



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