SMTA International Conference Proceedings


Author: Richard Otte
Company: PROMEX Industries, Inc.
Date Published: 10/4/2009   Conference: SMTA International

Abstract: The paper describes the most common geometries, material systems and manufacturing processes for QFN (quad flatpack no lead) in order to give the reader a broad, sound foundation for utilizing QFN packaging for semiconductors. Typical and most common dimensions are described as are the two primary material options (overmolded leadframe or BT substrate) and two primary manufacturing methods. (saw and punch singulation).

Key words: QFN, DFN, SON, LGA, molded package

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