ASSESSING RELIABILITY OF REBALLED BALL GRID ARRAY ASSEMBLIES UNDER TEMPERATURE CYCLING TESTAuthors: Lei Nie, Michael Osterman, and Michael Pecht
Company: Center for Advanced Life Cycle Engineering (CALCE) University of Maryland
Date Published: 10/4/2009 Conference: SMTA International
Under continuity monitoring, the temperature cycling test revealed that the reballed BGA assemblies using different reballing methods showed similar mean cycles to failure regardless of component type. However, the mean cycles to failure for reballed assemblies was lower than that of the mixed and the lead-free assemblies. The mean cycles to failure of the mixed assemblies was better than or equal to that of the lead-free assemblies. Failure analysis revealed that the failure site in reballed BGAs was located near the interface at the component side. Although the BGAs were reballed using different solder ball removal approaches, the failure sites were the same, which meant the reballing method did not influence the crack propagation in reballed assemblies. The mixed assemblies had the same failure site as the lead-free assemblies, which was near the interface at the component side. Some large cracks were found to propagate at the board side in the survived mixed assemblies.
Key words: Reballing, mixed assembly, lead-free
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