EFFECT OF STRUCTURAL DESIGN PARAMETERS ON WAFER LEVEL CSP BALL SHEAR STRENGTH: EXPERIMENTAL AND COMPUTATIONALAuthors: Nikhil Lakhkar and Dereje Agonafer
Company: Department of Mechanical Engineering, University of Texas-Arlington
Date Published: 10/4/2009 Conference: SMTA International
In this study, we conducted a wafer level ball shear tests and the study was validated computationally. A DOE was created for varying wafer level structural parameters like solder ball size and type, dielectric thickness and type of UBM. Ball shear tests are often easy to perform in the fabrication routine and are very important to check the process reliability.
Key words: Lead-Free Solder; Surface Finish, Solder Joint Reliability, Accelerated thermal cycling, and Finite Element Modeling.
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