NEXT GENERATION PoP PASTES FOR ELECTRONICS ASSEMBLYAuthors: Jim Hisert and Brandon Judd
Company: Indium Corporation
Date Published: 10/4/2009 Conference: SMTA International
There are fundamental differences between PoP pastes and the traditional solder pastes, which are designed for printing applications. This paper will highlight the differences between these solder pastes and talk about the characteristics needed by PoP pastes to increase transfer efficiency, eliminate head-in-pillow defects, and provide excellent solder wetting. If these three criteria are met, solder joint reliability will follow.
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