THE CHALLENGES OF PACKAGE ON PACKAGE (POP) DEVICES DURING ASSEMBLY AND INSPECTIONAuthors: Bob Willis and David Bernard
Company: ASKbobwillis.com and Dage Precision Industries
Date Published: 10/4/2009 Conference: SMTA International
The main industry problems associated with POP technology are open joints, warping of the two levels of component substrate and, of course, issues with the underlying printed circuit board (PCB). Reworking these stacked components, or just the top mounted part, can be challenging and when you inspect them using 2-D x-ray inspection the data can become difficult to interpret because of the multiple levels of ball interconnection and wire-bonding that may occur within the package.
This paper will outline the process associated with soldering stacked packages using dip flux and dip solder paste that are specifically designed to overcome the incidence of package warp. Based on the process issues involved, inspection results will be presented to better illustrate the challenges in implementing POP, or stacked packages, into production.
Key words: Package on Package, POP, components, x-ray inspection, defect, optical inspection, assembly.
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