ICSR (Soldering and Reliability) Conference Proceedings


WATER JET CUTTING FOR CROSS SECTIONING AND DE-PANELLING APPLICATIONS

Authors: Alex Kaldor, A.C. Rinella and Bev Christian
Company: Research In Motion
Date Published: 5/22/2009   Conference: ICSR (Soldering and Reliability)


Abstract: Traditional cross-sectioning of components, circuit boards and circuit packs is very time consuming. Over the years the latter two authors have tried a variety of methods to make the process more efficient. In the present study, water jet cutting was evaluated. A circuit pack was cross sectioned using the method in question by a third party vendor. The results indicated that the cut edges resulting from the abrasive water jet cutting were too rough and damaged for cross sectional analysis. The technique was tried for de-panelling with much more promising results.



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