ICSR (Soldering and Reliability) Conference Proceedings


THERMAL CYCLE TESTING OF PWBS – METHODOLOGY

Authors: Michael Freda and Paul Reid
Company: Sun Microsystems and PWB Interconnect Solutions
Date Published: 5/22/2009   Conference: ICSR (Soldering and Reliability)


Abstract: Reliability testing of printed wire boards (PWBs) by thermal cycling offers an ability to compare relative survivability through assembly and reliability in the end use environment. This article delineates an eleven step method to establish a test protocol that will maximize accuracy, applicability, reduced costs and reduce the propensity for confounded data in thermal cycle testing of bare PWBs exposed the lead-free assembly and rework simulation. The method presented in this paper is targeted to the unique challenges afforded by lead-free testing applications, testing the integrity of conductive interconnections and dielectric materials.

Key Words: reliability, pwb, PCB, thermal cycling, testing



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