RELIABILITY OF SAC305 AND SN3.5AG SOLDERS UNDER HIGH TEMPERATURE THERMAL CYCLINGAuthors: Elviz George, et al.
Company: City University of Hong Kong and CALCE, University of Maryland
Date Published: 5/22/2009 Conference: ICSR (Soldering and Reliability)
This paper presents the results of a study to assess the effects of temperature cycling with a peak temperature of 185oC on PBGAs, QFPs, and surface mount resistor packages assembled with SAC305 and Sn3.5Ag solder pastes on ENIG and Sn-based proprietary board finishes. The durability data of the components with different solder pastes and board finishes are then compared based on which recommendations are provided.
Keywords: high temperature, thermal cycling, ball grid array (BGA), lead-free solder, reliability
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.