GUIDELINES FOR ESTABLISHING A LEAD-FREE WAVE SOLDERING PROCESS FOR HIGH-RELIABILITY APPLICATIONSAuthor: J. Scott Nelson
Company: Harris Corporation
Date Published: 5/22/2009 Conference: ICSR (Soldering and Reliability)
The use of lead-free alloys in commercial electronics has been underway for almost a decade, but the use of lead-free solder in high-reliability applications is still very limited. This is at least in part due to a reluctance to change established assembly processes without historical reliability data.
Results from numerous reliability studies comparing tinlead to lead-free have yielded mixed results for SMT components but for through-hole components, durability testing has not yielded significant failure data to give cause for concern.
As the high-reliability community is pushed towards leadfree assembly, lead-free wave soldering may be the best place to start. This paper discusses the methodology to establish a lead-free wave soldering process for use in high reliability electronics assembly. Topics of discussion include specifications and contractual requirements, PWB and component requirements, flux and alloy selection, process parameter determination, product reliability concerns.
Keywords: Lead-free, Wave soldering
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.