LEAD-FREE ASSEMBLY OF SERVER CLASS PCBAs: QUALIFICATION TRIAL RESULTSAuthors: Matthew Kelly, et al.
Company: IBM Corporation
Date Published: 5/22/2009 Conference: ICSR (Soldering and Reliability)
This paper reports the reliability testing results of a lead-free assembly qualification trial on a mid-range complexity, high reliability PCBA sourced with three different printed circuit board (PCB) surface finishes. Reported results include electrical functionality through accelerated thermal cycling (ATC), isothermal high temperature storage (HTS), as well as combination shock / vibration / ATC testing. Mechanical four-point bend test results and implications will be discussed. Construction analyses of various interconnect technologies is also included.
Through continued product vehicle study, the capability of lead-free processing is being systematically assessed for the extension of its applicability to higher complexity PCBAs.
Key words: Lead-free server PCBA, product vehicle qualification trial, mid-range complexity, high reliability, TSOP failure, alternate surface finishes
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