DEVELOPMENT AND QUALIFICATION OF A PLASTIC BALL GRID ARRAY REPLACEMENT PROCESS
Author: R. Glenn Robertson Company: Alcatel Network Systems Date Published: 9/10/1996
Surface Mount International
Abstract: One of the challenges to widespread application of Plastic Ball Grid Array (PBGA) packaging is the requirement for specialized equipment and processes for replacement of a PBGA on an assembled board. This paper will outline the program at Alcatel Network Systems (ANS) to develop and qualify a PBGA replacement procedure. The procedure to be developed was required to be suitable for use by repair operators with average skills, and equipment cost had to be comparable with the cost of other SMT repair equipment. The process would be qualified to a quality level of a maximum of 1000 DPMO, at a confidence level of 95Y0. PBGAs assembled to test boards would be subjected to accelerated aging in an air-to-air thermal shock chamber, followed by destructive analysis.