RELIABILITY ASSESSMENT OF ALTERNATIVE LEAD-FREE ALLOYS USED DURING WAVE AND REWORKAuthors: Craig Hamilton, et al.
Company: Celestica and IBM Corporation
Date Published: 5/22/2009 Conference: ICSR (Soldering and Reliability)
This paper, an evolution of earlier work on this topic, discusses results obtained from an internally designed PTH test vehicle constructed to evaluate three commercially available alternative lead-free wave alloys: Sn-Cu-Ni, Sn-Ag-Cu-Bi and Sn-Cu-X by comparing their performance to SAC405 and SnPb alloys. The process performance of each alloy measured during earlier work will be summarized, including profile optimization and process yield analysis. The main intent of this paper is to validate the thermal reliability of a selection of alternative lead-free alloys compared to a SAC405 baseline. The thermal cycling profile used was 0-100°C at 1 cycle per hour (CPH) for 6,000 cycles. Detailed failure analysis is presented to identify and explain observed failure mechanisms. In addition, a comparison of the alloy behavior when subjected to mechanical load conditions vs. non-loaded thermal cycling will be briefly summarized from previous work. The objective of this work is to provide both thermal and mechanical reliability data which can be used to select a suitable wave alloy replacement for SAC305/405. The requirement being that the alternate alloy solution provides similar (or better) overall solder joint quality and reliability, under the conditions tested.
Key words: Wave Solder, Rework, Lead Free, Reliability
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