ICSR (Soldering and Reliability) Conference Proceedings


VAPOURPHASE VACUUM-SOLDERING: A NEW PROCESS TECHNOLOGY OPENS TREMENDOUS PRODUCTION CAPABILITIES WHEN REFLOW-SOLDERING

Authors: Claus Zabel and Allen Duck
Company: Asscon Systemtechnik and A-Tek LLC
Date Published: 5/22/2009   Conference: ICSR (Soldering and Reliability)


Abstract: A new machine technology combines a latest generation vapour-phase soldering machine - as optimal heat-transfer medium - with classical vacuum-technology. Thus it is now possible to solder absolutely void-free even areas as large as cigarette packages. Solder alloys with or without lead may be used with this new technology.

The problem of voids in solder joints is known since the beginning of the soldering technology. For the majority of soldering applications this was not a serious handicap, in some instances is actually considered helpful. However, with increasing integration density, the changing shape of the components as well as other demand profiles and application requirements of the electronic assemblies and their respective mechanical joints, there is an increasing demand for void-free solder joints. Until recently only small batches of such product could be processed in special vacuum ovens. There the solder product is heated either through conduction or radiation. Oxide-free soldering was only possible by applying multiple rinsings with a forming-gas. Due to the extremely long process times and a most complex process only small quantities may be soldered. Due to large process overheads and many rejects the cost for the end-product is very high.



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