ICSR (Soldering and Reliability) Conference Proceedings


FINE FEATURE STENCIL PRINTING 0.3MM PITCH COMPONENTS

Authors: Chris Anglin, et al.
Company: Indium Corporation and Research In Motion
Date Published: 5/22/2009   Conference: ICSR (Soldering and Reliability)


Abstract: The explosive growth of personal electronic devices such as mobile phones and personal music devices has driven the need for smaller and smaller passive and active electrical components. Not too long ago, 0401 (40 x 10 mils) passives were seen as the ultimate in miniaturization, but recently 0201 and now 01005 passives have arrived, with rumors of even smaller sizes to come. For active electrical components, the 0.4mm pitch component has become commonplace with 0.3mm already in the works.

What effect does this miniaturization have on the stencil printing process? Can it meet the challenge? This paper takes a preliminary look at some of the work that has been performed to evaluate the capability of the stencil printing process to print these fine feature components. Discussed is the stencil printing of the small features and efforts to obtain consistent volume in the printed solder paste deposit.



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