FINE FEATURE STENCIL PRINTING 0.3MM PITCH COMPONENTSAuthors: Chris Anglin, et al.
Company: Indium Corporation and Research In Motion
Date Published: 5/22/2009 Conference: ICSR (Soldering and Reliability)
What effect does this miniaturization have on the stencil printing process? Can it meet the challenge? This paper takes a preliminary look at some of the work that has been performed to evaluate the capability of the stencil printing process to print these fine feature components. Discussed is the stencil printing of the small features and efforts to obtain consistent volume in the printed solder paste deposit.
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