FLUID FLOW MECHANICS - NEW ADVANCES IN LOW STANDOFF CLEANING
Authors: Sinisa Aleksic, Ph.D., et al. Company: ZESTRON Date Published: 5/22/2009
ICSR (Soldering and Reliability)
Abstract: The associated increase in the complexity of components in the electronics industry results in a continuous decrease in standoff spacing between the components and the substrate’s surface. At the same time, the requirements for the product reliability and life expectation are continuously increasing, especially in the case of RF Technology. This in turn makes cleaning mandatory and the question arises as to which cleaning process can provide the required cleanliness levels under narrow capillary spaces. A suitable cleaning process should not only allow the cleaning media ample access to tight spaces, but it also has to remove contamination and discourage re-contamination. New innovative approaches are now being introduced to further address this increase in cleaning demand. These include innovations on the mechanical side as well as on the chemical. Chip components for example are currently placing the highest demand on removability as gaps are being reduced to less than 1 MIL. The presence of the latest chip components (i.e. 0201, 01005 and 01812) combined with other geometric obstacles has been noticed in the cleaning community. As such challenges emerge, users must therefore first determine that residues are cleanable by the cleaning agent of choice before even addressing this new geometric challenge. This paper is the third in a series of experimental data to be presented that will help users to overcome their respective cleaning issues. These findings are based on specifically designed cleaning fluids, developed through fluid mechanic modeling for the highest currently known cleaning requirements. Latest product technologies available in the market were compared to benchmark our findings.