ICSR (Soldering and Reliability) Conference Proceedings


ATTEMPTS TO CONSISTENTLY FORM VOIDS

Authors: Bev Christian, Graeme Williams and Andrew Michael
Company: Research In Motion
Date Published: 5/16/2008   Conference: ICSR (Soldering and Reliability)


Abstract: Several studies have been carried out to examine the effect of voids on solder joint reliability. In some of these studies the amount of voiding was less than is actually seen in production. The present work is a description of attempts to essentially turn voiding on and off at will by the addition of varying amounts of solvents to the solder paste before printing. The following solvents were tested: ethyl acetate, n-hexane, tetrahydrofuran, chloroform, acetone, carbon disulfide, water, mxylene and glycerol.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819