ICSR (Soldering and Reliability) Conference Proceedings


Authors: Bev Christian, Graeme Williams and Andrew Michael
Company: Research In Motion
Date Published: 5/16/2008   Conference: ICSR (Soldering and Reliability)

Abstract: Several studies have been carried out to examine the effect of voids on solder joint reliability. In some of these studies the amount of voiding was less than is actually seen in production. The present work is a description of attempts to essentially turn voiding on and off at will by the addition of varying amounts of solvents to the solder paste before printing. The following solvents were tested: ethyl acetate, n-hexane, tetrahydrofuran, chloroform, acetone, carbon disulfide, water, mxylene and glycerol.

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