ANALYZING AND PREDICTING ELECTROCHEMICAL MIGRATION FAILURES ON FIELD FAILURE RETURNSAuthor: Renee J. Michalkiewicz
Company: Trace Laboratories, Inc.
Date Published: 5/16/2008 Conference: ICSR (Soldering and Reliability)
Case studies are included. The general procedure is as follows: Monitoring points connected to the area of concern are isolated, often by removing components or cutting other traces and wires are soldered. The assemblies are placed in a temperature/humidity chamber and a bias is applied across the suspect location. The resistance between these isolated points is monitored for sudden or slow drops that are indicative of leakage current development or dendritic growth. If ECM development is observed on these assemblies from the same lot, the entire lot should be considered at risk.
Key Words: Electrochemical Migration, ECM, Dendritic Growth, Leakage Current, Field Failure
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