ICSR (Soldering and Reliability) Conference Proceedings


LEAD FREE MATERIAL AND PROCESS RE-QUALIFICATION FOR A RUGGED HANDHELD TERMINAL

Authors: André Gagné and Dan Meringer
Company: Psion Teklogix Inc
Date Published: 5/16/2008   Conference: ICSR (Soldering and Reliability)


Abstract: The new EU RoHS regulations have mandated the removal of lead, amongst other materials, from all electronic products put onto the EU market. To ensure the continued quality of the new lead free solder joints and to compare the integrity and ruggedness of our products in the absence of these materials, we have performed a series of mechanical environmental tests. Those test results verified that lead free solder can continue to provide reliable circuit joints in harsh environments under drop/shock and vibration conditions.

After reviewing the test results and weighing factors such as type, severity, quality and quantity of defects, we recommend the use of No Clean flux over Aqueous flux. SAC 305 or SAC 387 solder alloy are both acceptable. ENIG and Immersion Silver plating of the PCBs are both acceptable. This recommendation is based on the limited types of solder paste and PCB materials initially recommended for use by our EMS vendor. Similar qualification testing is recommended if other EMS vendors or solder paste manufacturers are to be used, as the test results show that the selected paste and processes may have influence on the ruggedness of our product.

Key Words: lead-free, rugged, reliability



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