LEAD FREE MATERIAL AND PROCESS RE-QUALIFICATION FOR A RUGGED HANDHELD TERMINALAuthors: André Gagné and Dan Meringer
Company: Psion Teklogix Inc
Date Published: 5/16/2008 Conference: ICSR (Soldering and Reliability)
After reviewing the test results and weighing factors such as type, severity, quality and quantity of defects, we recommend the use of No Clean flux over Aqueous flux. SAC 305 or SAC 387 solder alloy are both acceptable. ENIG and Immersion Silver plating of the PCBs are both acceptable. This recommendation is based on the limited types of solder paste and PCB materials initially recommended for use by our EMS vendor. Similar qualification testing is recommended if other EMS vendors or solder paste manufacturers are to be used, as the test results show that the selected paste and processes may have influence on the ruggedness of our product.
Key Words: lead-free, rugged, reliability
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