A STUDY OF THE PROCESS PERFORMANCE OF ALTERNATIVE LEAD FREE WAVE ALLOYSAuthors: Craig Hamilton and Matthew Kelly
Company: Celestica Inc. and IBM Corporation
Date Published: 5/16/2008 Conference: ICSR (Soldering and Reliability)
This study focused specifically on researching 4 available alternative lead free alloys used in the wave and solder fountain processes. All of the alternative lead free alloys were compared against a SAC405 baseline. The results from earlier trials characterizing each of the alternative lead free alloys copper dissolution rates will be discussed. In addition, the process performance of three of the alternative alloys within the wave solder process, based on the results of the Phase 1 trials will be discussed, which includes profile optimization and process yield analysis using an internally designed wave test vehicle.
Key words: Alternative Pb-free Alloys, Cu Dissolution, Quality, Defects, Process Window
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