SYSTEM-ON-WAFER BY 3D ALL SILICON SYSTEMS TECHNOLOGYAuthors: Rao Tummala, et al.
Company: Microsystems Packaging Research Center at Georgia Institute of Technology, Fraunhofer Institute, and Korea Advanced Institute of Science and Technology (KAIST)
Date Published: 2/12/2009 Conference: Pan Pacific Symposium
Key words: System-on-Wafer (SOW), Through Silicon Via (TSV), Silicon Interposer, Second Law of Electronics, embedded components.
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