Pan Pacific Symposium Conference Proceedings


SYSTEM-ON-WAFER BY 3D ALL SILICON SYSTEMS TECHNOLOGY

Authors: Rao Tummala, et al.
Company: Microsystems Packaging Research Center at Georgia Institute of Technology, Fraunhofer Institute, and Korea Advanced Institute of Science and Technology (KAIST)
Date Published: 2/12/2009   Conference: Pan Pacific Symposium


Abstract: Electronics has been, and continues to be, one of the largest global industries. It has been the driving engine for science, engineering and manufacturing, leading to the global prosperity not only in the U.S. but also in those parts of the world that invested and participated in it. The first electronics wave, which started with the invention of the transistor, has been largely due to Moore’s Law or the First Law of Electronics, and the associated hybrid approaches from design to systems using 100s of discrete components made of ceramics, organics, silicon, metals and alloys. The end of the era using this approach seems evident beyond 32nm. The second need is to do with greatly improved volumetric functional density, which requires miniaturization of the entire system, which is currently at milliscale, and which can be developed to nanoscale. Such a concept, over the long term, leads to an all silicon system-on-wafer concept presented in this paper.

Key words: System-on-Wafer (SOW), Through Silicon Via (TSV), Silicon Interposer, Second Law of Electronics, embedded components.



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