SUPER HIGH DENSITY TWO METAL LAYER ULTRA-THIN ORGANIC SUBSTRATES FOR NEXT GENERATION SYSTEM-ON-PACKAGE (SOP),Authors: Venky Sundaram, et al.
Company: Microsystems Packaging Research Center at Georgia Tech, Atotech, and Rogers Corporation
Date Published: 2/12/2009 Conference: Pan Pacific Symposium
The System-On-Package (SOP) concept, pioneered by Georgia Tech PRC, is focused on convergence of functions (digital, RF, optoelectronics, MEMS, etc) in a single package or module. Some of these fundamental packaging concepts have been implemented recently in an on-going, multi-year R&D program focused on embedded thin-film passive and active components (EMAP) for mobile product applications. This project is being jointly supported by semiconductor, systems and supply chain companies. A key technology building block in the EMAP research involves ultra-thin and low-loss organic substrates with an emphasis on minimizing cost. The research targets for this substrate are 50-100µm thick glass-reinforced laminate cores, 15-20µm thick build-up dry-film dielectric, 30-50µm diameter through-vias in the core, 25-40µm diameter blind microvias, and 15µm lines/spaces on both the core and build-up layers. The substrate is designed to match 30µm on-chip I/O pad pitch in a peripheral configuration with two chip sizes of 3mm x 3mm and 7mm x 7mm.
This paper describes results from collaborative research to achieve the wiring density of the 1+2+1 substrate within a two metal layer (2ML) thin core with filled through vias and ultra-fine lines. The reduction in layer count and elimination of build-up layer processing is anticipated to significantly reduce the substrate cost, thus enabling the organic substrate to be competitive with re-distribution layers used in wafer-level packaging. This research includes use of a state-of-the-art electroless and electrolytic copper plating process to achieve the required ultra fine line circuitry and through-via filling. These processes have been optimized on next-generation dielectrics characterized by ultra-low loss, low dielectric constant, low CTE and low moisture uptake with stable properties up to 40GHz. Results from various processes needed to achieve the super high-density 2ML substrate will be presented, as well as reliability evaluations of the completed substrate structures.
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