3D-LSI TECHNOLOGY FOR THE IMAGE SENSOR DEVICESAuthors: Makoto Motoyoshi, Hirofumi Nakamura, and Manabu Bonkohara
Company: ZyCube Co., Ltd.
Date Published: 2/12/2009 Conference: Pan Pacific Symposium
In this paper, the process and structure of the CSP for CMOS image sensors using current and advanced 3D-LSI technology are presented. Using the current technologies, CSPs for 1.3M, 2M, and 5M pixel CMOS image sensors are successfully fabricated without performances degradation. One of many potential applications for 3D-LSI is the high performance focal plane array image sensors. We propose the high-speed image sensor with 100% optical fill factor by using next generation 3D-LSI technology with µ-bump and µ-through silicon via (TSV).
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