Pan Pacific Symposium Conference Proceedings


QUALITY ASSURANCE OF STACKED COMPONENTS USING QUICKSCAN

Author: Friedhelm W. Maur
Company: YXLON International – Feinfocus Products
Date Published: 2/12/2009   Conference: Pan Pacific Symposium


Abstract: With the increasing demand for more functionality and smaller size of portable devices such as cell phones, mp3 players, and GPS units, the performance and size of individual electronic components have become critical. Engineering a single package with multiple chips stacked vertically one on top of the other results in smaller and more efficient packaging of devices, yet will have the combined computing power of the two individual integrated processors.

As component engineers escalate from 2D single die designs to 3D multiple die package solutions, the typical inspection tools are no longer sufficient. While Microfocus 2D X-ray has been the traditional inspection tool to verify wire bond and flip chip integrity, with multiple layers of interconnects, the resulting 2D image from an X-ray microscope is often too intricate to analyze effectively. These complex assemblies drive the need to virtually crosssection a sample to simplify inspection.

Computed tomography (CT) is the preferred way for 3-dimensional analysis of complex electronic assemblies. Microfocus CT X-Ray systems offer high resolution and advanced detail detectability, yet have suffered from major limitations in terms of speed and throughput, resulting in low ROI and slow adoption by the manufacturing and quality assurance departments. This paper demonstrates how µCT can simplify the inspection process of stacked die components, and identifies recent advancements that extend CT-applicability from the lab to the production floor.

Key words: X-ray inspection, Microfocus, PCB inspection, BGA, flip-chip, CT



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