Pan Pacific Symposium Conference Proceedings


STUDY OF APPLICATION AND RELIABILITY OF LOW MELTING POINT Sn-Zn-Bi-In-P SYSTEM LEAD-FREE ALLOYS

Author: Jusheng Ma
Company: Department of Materials Science and Engineering, Tsinghua University
Date Published: 2/12/2009   Conference: Pan Pacific Symposium


Abstract: The new Sn-Zn-Bi-In-P lead-free solder has good solderability, low melting point and the same reflow profile as the Sn-37Pb eutectic solder. The bonding strength of the Sn-Zn-Bi-In-P solder joint is 1.5 times higher than that of the Sn-37Pb solder joint. After thermal fatigue, the fatigue life of the former is 25% more than that of the latter. The microstructure and composition of the solder joint interface are also studied. A Zn-rich layer is found at the interface which can prevent the diffusion of Sn and Cu atoms, consequently decrease the thickness of the intermetallic compound layer. The results of EDX and TEM indicate that the intermetallic compound is Cu5Zn8. The solder paste has been produced and tested on the production line to evaluate its performance.

Key words: low temperature lead-free sold alloys, application, reliability



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819