THE ULTIMATE ADHESION ENHANCEMENT PROCESS FOR MSL IMPROVEMENTAuthors: Olaf Kurtz, et al.
Date Published: 2/12/2009 Conference: Pan Pacific Symposium
This article describes a new patented process which is characterized by an extended bath life, providing high metal holding capability, and also contains an effective smut removal agent for use with the silicon containing C7025 base material.
The resultant surface topography ensures enhanced bonding between the leadframes and the mold compound used in IC assembly. These process benefits provide a significant improvement in achievable MSL for all package types.
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