Pan Pacific Symposium Conference Proceedings


THE ULTIMATE ADHESION ENHANCEMENT PROCESS FOR MSL IMPROVEMENT

Authors: Olaf Kurtz, et al.
Company: Atotech
Date Published: 2/12/2009   Conference: Pan Pacific Symposium


Seika Machinery, Inc.

Abstract: With the development of 'environmentally friendly' integrated circuits (ICs) at reduced thickness, the manufacturing of thermally reliable products becomes more and more demanding. In order to achieve an equivalent reliability standard for state-of-the-art ICs like QFNs (Quad Flat No-Lead), expressed in terms of achievable moisture sensitivity level (MSL), new technologies have to be introduced.

This article describes a new patented process which is characterized by an extended bath life, providing high metal holding capability, and also contains an effective smut removal agent for use with the silicon containing C7025 base material.

The resultant surface topography ensures enhanced bonding between the leadframes and the mold compound used in IC assembly. These process benefits provide a significant improvement in achievable MSL for all package types.



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