Pan Pacific Symposium Conference Proceedings


DEVELOPMENT OF LOW MODULUS CONDUCTIVE ADHESIVES FOR MEMS INTERCONNECTS

Authors: Helge Kristiansen, et al.
Company: Conpart AS, SINTEF ICT, Norwegian Defence Research Establishment (FFI), Vestfold University College
Date Published: 2/12/2009   Conference: Pan Pacific Symposium


Abstract: Isotropic conductive adhesives (ICA) have been used for electronics application for more than 40 years. Traditionally, these adhesives have been made using silver particles or flakes, but also other conductor elements have been used like carbon, copper and nickel. Designing an ICA requires optimisation of a number of factors including final conductivity, rheological properties, total metal content (a cost issue in the case of noble metals) and thermo-mechanical properties [1]. The different implications will be discussed in this paper.



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