Pan Pacific Symposium Conference Proceedings


DEVELOPMENT AND CHARACTERISATION OF METAL COATED POLYMER BALLS FOR CSP APPLICATION

Authors: Helge Kristiansen, et al.
Company: Conpart AS, NTNU Nanomechanical Lab, SINTEF ICT
Date Published: 2/12/2009   Conference: Pan Pacific Symposium


Abstract: A metal-coated ball with polymer core is under development for Chip Scale Packaging (CSP) applications. Different polymer cores have been produced and evaluated to optimise the mechanical properties of the ball. From a range of material candidates with highly diverse properties, one has been established as the best suited polymer for the core. The selection has been based on measurements of thermal expansion coefficient and Emodulus.

Key words: Polymer core, mechanical testing, interconnect, metallization



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