Pan Pacific Symposium Conference Proceedings


HEAVY THERMAL LOAD PB-FREE WAVE SOLDERING – GETTING TOP HOLE FILLETS WITH +3 OZ. COPPER PLANES

Authors: Corey Peterson and Jeff Kennedy
Company: Rockwell Automation and Celestica
Date Published: 2/12/2009   Conference: Pan Pacific Symposium


Abstract: High copper weight boards have always been difficult to achieve consistent and adequate hole fill and have been a challenge for every wave solder process engineer. Reasons for this have been well reported and documented. Certainly high copper weight boards with internal ground plane structures act like heat sink. This usually has a detrimental effect on hole fill. While much work and experimentation has investigated many parameters of the wave soldering process, one item seems to be missing.

A thorough review and understanding of fluxer operation, fluxer setup methodology and performance capability analysis. The ability to flux fill up the top of the PTH barrel with the component lead in the hole could be the single most important contributor to hole fill.

Results of this work show how improvements in understanding and setup of wave solder, fluxing, and wave configuration can help meet IPC-A-610 class 3 hole fill requirements for heavy thermal loaded products. The evaluations took place on several different wave machine configurations and final results meeting the product requirements have been achieved - up to 100% fill for 125 mil thick boards with 26oz of copper (4 – 5oz inner layer, 2 – 3oz outers) at process speeds exceeding 2.5 ft/min. This paper will discuss the various trials and detailed results leading up to the recent success.



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