HEAVY THERMAL LOAD PB-FREE WAVE SOLDERING – GETTING TOP HOLE FILLETS WITH +3 OZ. COPPER PLANESAuthors: Corey Peterson and Jeff Kennedy
Company: Rockwell Automation and Celestica
Date Published: 2/12/2009 Conference: Pan Pacific Symposium
A thorough review and understanding of fluxer operation, fluxer setup methodology and performance capability analysis. The ability to flux fill up the top of the PTH barrel with the component lead in the hole could be the single most important contributor to hole fill.
Results of this work show how improvements in understanding and setup of wave solder, fluxing, and wave configuration can help meet IPC-A-610 class 3 hole fill requirements for heavy thermal loaded products. The evaluations took place on several different wave machine configurations and final results meeting the product requirements have been achieved - up to 100% fill for 125 mil thick boards with 26oz of copper (4 – 5oz inner layer, 2 – 3oz outers) at process speeds exceeding 2.5 ft/min. This paper will discuss the various trials and detailed results leading up to the recent success.
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