Pan Pacific Symposium Conference Proceedings


HIGH PERFORMANCE THERMAL INTERFACE MATERIALS AND RELIABILITY IN ELECTRONIC ASSEMBLY

Author: Radesh Jewram
Company: The Bergquist Company
Date Published: 2/12/2009   Conference: Pan Pacific Symposium


Abstract: As electronics systems are getting faster, more compact, portable and hotter, higher performing Thermal Interface Materials will be required. These Thermal Interface materials include greases, phase change materials, solders, gap filling liquids/pads, laminating adhesives and liquid adhesives. As much as the end-of-line performance is critical; so is the reliability of the materials in the interface over the lifetime of the electronic assembly. The reliability criteria are different for different types of TIMS.



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